Achieving a 10:1 Aspect Ratio in 3D Reservoir Chambers of Borosilicate Glass Microfluidic Chips Using 1030 nm Femtosecond Laser Marking
Abstract:
The integration of 1030 nm femtosecond laser marking technology into the fabrication of borosilicate glass microfluidic chips offers a precision tool for creating intricate 3D structures with high aspect ratios. This study explores the optimal parameters for achieving a deep-width ratio of 10:1 in reservoir chambers, a critical feature for enhancing the functionality and performance of microfluidic devices.
Introduction:
Microfluidic chips, made from borosilicate glass, are widely used in various fields such as chemistry, biology, and medical diagnostics due to their ability to handle small volumes of fluids with precision. The creation of 3D reservoir chambers with high aspect ratios is essential for applications requiring large storage capacities within a small footprint. Femtosecond laser marking machines offer the precision and control needed to etch these complex structures without compromising the integrity of the glass.
Materials and Methods:
Borosilicate glass samples were prepared and subjected to femtosecond laser marking using a 1030 nm wavelength laser. The laser system was configured to operate at a pulse width of less than 500 femtoseconds and a repetition rate adjustable from 1 kHz to 1 MHz. The energy per pulse was varied to find the optimal setting for achieving the desired aspect ratio without causing damage to the glass. The focus was controlled using a dynamic focusing system to maintain a consistent spot size throughout the etching process.
Results:
The experiments revealed that a pulse energy of 5 µJ, a repetition rate of 500 kHz, and a scanning speed of 100 mm/s resulted in a deep-width ratio close to 10:1. At these parameters, the laser was able to etch the glass to a depth of 500 µm while maintaining a width of 50 µm. The use of a galvo scanner with a high-speed response allowed for precise control over the laser's path, ensuring uniformity in the etched features.
Discussion:
The key to achieving a high aspect ratio in 3D reservoir chambers is the balance between pulse energy and scanning speed. Too high an energy can lead to excessive heat affecting the surrounding material, while too low an energy results in inadequate etching. The repetition rate must be high enough to provide the necessary energy for deep etching but not so high as to cause thermal damage.
Conclusion:
The study demonstrates that with careful control of femtosecond laser parameters, it is possible to achieve a 10:1 aspect ratio in 3D reservoir chambers of borosilicate glass microfluidic chips. This capability opens up new possibilities for the design and functionality of microfluidic devices, particularly in applications where high storage capacity and precise fluid control are required.
Keywords: Femtosecond Laser Marking, Borosilicate Glass, Microfluidic Chips, 3D Reservoir Chambers, Aspect Ratio, Etching Parameters
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